customer service hotline
0755-27918093-8012
Full auto RFID Flip Chip Assembling Machine adopt the flip chip on board technology to produce the RFID inlays, through high-precision modular mechanism, pick the chip from wafer, then place on pre-dispensing conductive glue with hot press, solidify wafer on the etched antenna, to conduct chip and substrate antenna, so that achieve RFID Inlay bonding. Precise vision system make sure accurately positioning and monitor the RFID chip and antenna bonding. Integrate with glue dispensing, chip pick and placement, transportation, hot press, testing and unloading.
Technical parameters：
Overall Dimension | About L 6500*W 1280*H 1950 mm |
Weight | About 2800kg |
Power Supply | AC 220V 50/60Hz |
Power | 18KW |
Air Pressure | 6KG/CM2 |
Control | PC |
Width of Material | 50~400 mm |
Bonding Accuracy | ±0.02~0.03mm |
Applicable Material | PET, PVC, paper |
Specification of Wafer Ring | 8"/12" |
Chip Size | 0.2X0.2~2.0X2.0 mm |
Outer Diameter of Core | Max. 600mm |
Inner Diameter of Core | 76mm |
UPH | About 15K pcs/Hr |
Pass Rate | About 99.99% |
Tel：+86-755-27918093/23060983
Fax：+86-755-27918086
Add：Building B, Hongxing Xifang Industrial Park,Datianyang,
Songyu Road, Songgang Street,Bao'An District,
Shenzhen, 518105, China
All Rights Reserved ? 2019 Shenzhen Yuanmingjie Technology Co., Ltd 粵ICP備2022052599號 Design by:35.com
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